Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel is advancing its Embedded Multi-die Interconnect Bridge (EMIB) technology to facilitate next-gen semiconductor products, emphasizing the importance of robust design methodologies in packaging success. Collaborating with Synopsys, Intel leverages EDA tools to address challenges in advanced package design, analysis, and verification, enabling designers to optimize EMIB benefits while reducing development risks. EMIB technology allows for dense interconnect pathways between dies, offering performance advantages with flexibility and cost efficiency. Synopsys' suite of advanced packaging tools supports Intel's EMIB design ecosystem, facilitating concurrent chip-package co-design to optimize performance and improve product quality. The collaboration underscores the significance of ecosystem readiness in the chiplet era for broader adoption of advanced packaging solutions in AI, high-performance computing, and data center applications.